Multi-layers-FPC for comunication

#1
Quick Details
Place of Origin:ChinaBrand Name:INNOModel Number:0018
Base Material:polyimide,FR4Copper Thickness:0.5oz-2ozBoard Thickness:1.6mm or 0.2-4.0mm, Flex 0.01-0.25mm
Min. Hole Size:0.01'',0.25mm, or 10milsMin. Line Width:0.075mm (3mil)Min. Line Spacing:0.075mm (3mil)
Surface Finishing:Surface Finishing HASL,Nickle,Immersion Gold,Immersion Tin,Immersion SProduct name:flex-rigid pcb for universal remote controlOther name:rigid-flex pcb board
Copper thickness:9um / 12um / 18um / 35umSoldermask Color:amber (green)Standard Production layer:2 layer - 10 Layer
Materials:polyimide / FR4Cover Layer Polyimide:laser cutting / punching / drilledOut packing:according to the customer's requirement
ID print:WhiteCertificate:ROHS,UL,ISO9001 etc
Inno Circuit, one of the professional and credible manufacturers and suppliers of PCB, now brings you the best quality romote control pcb at low price. Introducing advanced equipment and employing qualified workers, we have been continuing to innovate. Now, please feel free to check the quotation with us and get the free sample from us.
FAQ
1. Another approach is to ensure that the digital/analog layout is separated and that the digital/analog signal traces do not cross each other. The entire PCB board is not divided, and the digital/analog ground is connected to this ground plane. What's the reason?
The requirement that the digital-to-analog signal traces do not cross is because the return current path of the slightly faster digital signal will flow back to the source of the digital signal along the ground near the trace, if the digital-to-analog signal traces. Crossover, the noise generated by the return current will appear in the analog circuit area.
2. How to consider impedance matching when designing high-speed PCB design schematics?
When designing high-speed PCB circuits, impedance matching is one of the design elements. The impedance value has an absolute relationship with the wiring method, such as walking on the microstrip or double stripline, distance from the reference layer (power or ground), trace width, PCB material, etc. Both will affect the characteristic impedance of the trace. In other words, the impedance value can be determined after wiring. General simulation software can not consider some impedance discontinuity routing conditions due to the limitations of the circuit model or the mathematical algorithm used. At this time, only a few terminators (such as series resistance) can be reserved on the schematic diagram. Eliminate the effect of discontinuity in the trace impedance. The only way to truly solve the problem is to pay attention to avoiding impedance discontinuities when wiring.
3, where can provide a more accurate IBIS model library?
The accuracy of the IBIS model directly affects the results of the simulation. Basically, IBIS can be regarded as the electrical characteristics data of the actual chip I/O buffer equivalent circuit. Generally, it can be obtained by converting the SPICE model (measurement can also be used, but the limitation is more). SPICE data and chip manufacturing have absolute The relationship, so the same device is provided by different chip vendors, their SPICE data is different, and then the data in the converted IBIS model will also vary. In other words, if A-devices are used, only they have the ability to provide accurate model data for their devices, because no one else knows better than what their device is made of. If the IBIS provided by the manufacturer is inaccurate, it can only be continuously required to be improved by the manufacturer.Multi-layers-FPC for comunication
website:http://www.success-stone.com.cn/flex-rigid-pcb/mobile-phone-flex-rigid-pcb/